BOBST, in collaboration with key industry partners, held a two-day roadshow in Istanbul and Gaziantep in February 2024, highlighting the latest innovations in flexible packaging and labels. The event attracted packaging professionals from across Turkey to explore sustainable solutions and digital technologies.
“The strong attendance at both locations reflects the Turkish packaging industry’s commitment to innovation and sustainability,” said Eric Pavone, BOBST AFMETR Region Business Director. “By bringing together expertise across the packaging value chain, we demonstrated how collaboration drives progress in sustainable label and packaging solutions.”
Key presentations focused on BOBST’s oneBARRIER technology, designed for recycle-ready mono-material substrates in flexible packaging, alongside digital printing innovations and the BOBST Connect platform, which optimizes workflow and connectivity. Industry partners such as UPM, Reifenhäuser, Michelman, Esko, Sun Chemical, and Miraclon shared insights on solutions ranging from recyclable paper-based packaging to advanced prepress technologies.
“Reflecting global trends, the Turkish market is showing strong interest in technologies that combine sustainability with high performance,” said Cihat Ayan, Zone Business Director FP/NMW – Turkey at BOBST. “This roadshow demonstrated how BOBST and our partners are delivering innovations that help converters meet evolving market demands while enhancing sustainability profiles.”
Attendees also engaged in interactive sessions and live demonstrations of BOBST Connect, showcasing how digitalization and connectivity can enhance production efficiency.
The event underscored BOBST’s commitment to advancing the packaging industry through four strategic pillars: connectivity, digitalization, automation, and sustainability. The high turnout and engagement reflected Turkey’s growing interest in sustainable packaging and digital transformation.